Emerging Cooling Technologies

Heatsinks with Reduced Thermal Expansion

Heatsinks w/Reduced Thermal Expansion

MC2 is constantly working to improve its product line, through both federally-sponsored and in-house development efforts. Current efforts include:

  • Development of aluminum and beryllium coolers for weight-sensitive applications (sponsored by DARPA & iARPA, respectively).
  • Two-phase microchannel cooling (sponsored by MDA).
  • Development of coolers with reduced thermal expansion.
  • Higher performance coolers.

If you have any interest in these emerging technologies, please contact us to discuss how we might address your needs during our development work.